New SMT Equipment: solder evaluations (Page 1 of 11)

Solder Training and Solder Certification Courses

New Equipment | Education/Training

Solder Training and Solder Certification Courses Taught in Accordance With IPC Soldering Guidelines. We offer a variety of customized courses set up specifically for our customers requirements.  An example would be our combination type certificate t

Precision PCB Services, Inc

Workmanship Standards & Soldering Instruction for Through-Hole Components, Wires & Terminals

New Equipment | Education/Training

An 8 hour combined lecture, video and  hands on session that includes: Soldering techniques for soldering wires to terminals including through-hole components. Identify the different types of solder terminals, connectors, and through hole compone

Precision PCB Services, Inc

J-STD-001 Instructor (CIT) - Training and Certification

J-STD-001 Instructor (CIT) - Training and Certification

New Equipment | Education/Training

This is a combination lectured and hands-on course covering the information in the IPC J-STD-001 ­document. The J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”, describes materials, method and acceptance

EPTAC Corporation

PCB Rework and Repair Training

New Equipment | Education/Training

This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more.  Students will be introduced to the proper techniques for SMT & PTH compon

Precision PCB Services, Inc

BGA Reballing Training

New Equipment | Education/Training

In this One-Day class you will learn successful techniques to re-ball BGA Components.  Both Lead and Lead Free Solder Balls will be covered.  The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the

Precision PCB Services, Inc

Qualification of Bare Boards

Qualification of Bare Boards

New Equipment | Test Services

Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specifications for Rigid Printed Boards and

ACI Technologies, Inc.

Power Packaging Services

New Equipment | Design Services

The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit the advantages of advanced mat

ACI Technologies, Inc.

Yamaha Σ-F8S Modular PCB Chip Mounter

Yamaha Σ-F8S Modular PCB Chip Mounter

New Equipment | Pick & Place

Yamaha Σ-F8S Modular PCB Chip Mounter ❙ Features of Yamaha PCB Chip Mounter High speed pick and place machine, Yamaha Σ-F8S premium modular PCB chip mounter with 150,000 CPH, 4 heads. used for full-auto SMT productio

Dongguan Intercontinental Technology Co., Ltd.

​Yamaha YSM20WR Modular SMT Placement

​Yamaha YSM20WR Modular SMT Placement

New Equipment | Pick & Place

​Yamaha YSM20WR Modular SMT Placement​ ❙ Features of Yamaha YSM20R​  High-efficiency modular Yamaha SMT placement, Yamaha chip mounter YSM20R, applicable components 0201 to W55 x L100mm, Height 15mm or less, placement

Dongguan Intercontinental Technology Co., Ltd.

Gold Embrittlement Evaluation of Solder Joints

Gold Embrittlement Evaluation of Solder Joints

New Equipment | Test Services

Gold embrittlement of solder joints has been a concern for many decades.  SEM Lab, Inc. supports evaluation for this condition. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. https://s

SEM Lab, Inc.

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